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Stress-Induced Phenomena in Metallizations: 1st International Workshop 1st International Workshop on Stress-Induced Phenomena in Metallizations Che-Yu Li, Cornell University, USA ; Paul S. Ho, The University of Texas at Austin, Interconnect and Packaging Group, Austin, TX, USA ; Paul Totta, IBM Microelectronics Division, USA |
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Published ; ISBN 1-56396-082-6, One Volume, Print; 0 pages; $95.00 Readership: Related AIP Titles: |
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