Stress-Induced Phenomena in Metallization: 2nd International Workshop

2nd International Workshop on Stress-Induced Phenomena in Metallization

Paul S. Ho, The University of Texas at Austin, Interconnect and Packaging Group, Austin, TX, USA ; Paul Totta, IBM Microelectronics Division, USA ; Che-Yu Li, Cornell University, USA

Conference Location and Date: Austin, TX, USA, 29-31 March 1993

Published ; ISBN 1-56396-251-9, One Volume, Print; 0 pages; $120.00

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