Stress-Induced Phenomena in Metallization: 3rd International Workshop

3rd International Workshop on Stress-Induced Phenomena in Metallization

Paul S. Ho, The University of Texas at Austin, Interconnect and Packaging Group, Austin, TX, USA ; Che-Yu Li, Cornell University, USA ; John Sanchez, University of Michigan, USA ; John Bravman, Stanford University, USA

Conference Location and Date: Palo Alto, CA, USA, 21-23 June 1995

Published ; ISBN 1-56396-439-2, One Volume, Print; 0 pages; $140.00

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