STRESS INDUCED PHENOMENA IN METALLIZATION: Sixth International Workshop On Stress Induced Phenomena In Metallization

Sixth International Workshop on Stress Induced Phenomena in Metallization

Shefford P. Baker, Cornell University, Department of Materials Science and Engineering, Ithaca, NY, USA ; Paul S. Ho, The University of Texas at Austin, Interconnect and Packaging Group, Austin, TX, USA ; Eduard Arzt, Max-Planck-Institut fur Metallforschung, Stuttgart, GERMANY ; Matti A. Korhonen, Cornell University, Department of Materials Science and Engineering, Ithaca, NY, USA

Conference Location and Date: Ithaca, New York, 25-27 July 2001

Subseries: Materials Physics and Applications

Published April 2002; ISBN 0-7354-0058-X, One Volume, Print; 259 pages; 6 3/8 X 9 1/4 inches; Hardcover; $145.00

Readership: These Proceedings will be read primarily by academic and industrial researchers, and by people responsible for product development or manufacturing in companies. Companies that produce microelectronic integrated circuits of all kinds are the most closely concerned with this subject, but any company that produces products with small-scale metallizations, as well as academics working in associated areas, should be interested. Examples include optics (lenses, mirrors, filters, etc.), microelectromechanical devices (optical switches, mirror arrays, microfluidic devices, sensors and actuators), and many others. This book will also be read by managers, production engineers, and students who have interests in this area.

Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.

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