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REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 24

Review of Progress in Quantitative Nondestructive Evaluation Volume 24

Donald O. Thompson, Iowa State University, Aerospace Engineering, Ames, IA, USA ; Dale E. Chimenti, Iowa State University, Aerospace Engineering, Ames, IA, USA


AIP Conference Proceedings 760


Conference Location and Date: Golden, Colorado, 25-30 July 2004

Subseries: Materials Physics and Applications

Published April 2005; ISBN 0-7354-0245-0 Two Volume Print, CD-ROM included; 2093 pages; 7x10 inches; Hardcover; $405.00

Readership: Academic research faculty and students; industrial NDE researchers and designers; governmental researchers; and program planners

All papers were peer reviewed. These proceedings provide the latest research and devlopment papers in Nondestructive Evaluation (NDE) and its applications to flaw detection, material properties, and structural reliability. The papers are prepared by a line-up of internationally known researchers and are reviewed by qualified scientists. Papers cover recent developments in essentially all measuring techniques (ultrasonics, electromagnetic, x-rays, thermal, acoustic emission, etc.) and their applications to flaw detection and structural reliability.

Related AIP Titles:
CP# Editor(s) Title
955Elert, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2007: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
945Ogawa, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: Ninth International Workshop on Stress-Induced Phenomena in Metallization
931Seiler, et al.CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2007 International Conference on Frontiers of Characterization and Metrology
908Cesar de Sa / SantosMATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications; NUMIFORM 2007 Proceedings of the 9th International Conference on Numerical Methods in Industrial Forming Processes
894Thompson / ChimentiREVIEW OF PROGRES IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 26
893Jantsch / SchafflerPHYSICS OF SEMICONDUCTORS: 28th International Conference on the Physics of Semiconductors
845Furnish, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2005: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
838Atchley, et al.INNOVATIONS IN NONLINEAR ACOUSTICS: ISNA 17; 17th International Symposium on Nonlinear Acoustics including the International Sonic Boom Forum
837Myneni / HjörvarssonHYDROGEN IN MATTER: A Collection from the Papers Presented at the 2nd International Symposium on Hydrogen in Matter; ISOHIM
824BalachandranADVANCES IN CRYOGENIC ENGINEERING: Transactions of the International Cryogenic Materials Conference - ICMC, Volume 52
820Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 25
817Zschech, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: 8th International Workshop on Stress-Induced Phenomena in Metallization
788Seiler, et al.CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY 2005:
786Kuzmany, et al.ELECTRONIC PROPERTIES OF NOVEL NANOSTRUCTURES: XIX International Winterschool/Euroconference on Electronic Properties of Novel Materials
778Smith, et al.NUMERICAL SIMULATION OF 3D SHEET METAL FORMING PROCESSES: 6th International Conference and Workshop on Numerical Simulation of 3D Sheet Metal Forming Processes; NUMISHEET 2005
772Menéndez / Van de WallePHYSICS OF SEMICONDUCTORS: 27th International Conference on the Physics of Semiconductors
765Gracia, et al.INDUSTRIAL APPLICATIONS OF THE MÖSSBAUER EFFECT: International Conference on the Industrial Applications of the Mössbauer Effect
759Hernández-Pozos / Olayo-GonzalezMATERIALS SCIENCE AND APPLIED PHYSICS: Second Mexican Meeting on Mathematical and Experimental Physics
741Ho, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization
725FritzscheDNA-BASED MOLECULAR ELECTRONICS: International Symposium on DNA-Based Molecular Electronics
723Kuzmany, et al.ELECTRONIC PROPERTIES OF SYNTHETIC NANOSTRUCTURES: XVIII International Winterschool/Euroconference on Electronic Properties of Novel Materials
712Ghosh, et al.MATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications; NUMIFORM 2004 Proceedings of the 8th International Conference on Numerical Methods in Industrial Forming Processes
711BalachandranADVANCES IN CRYOGENIC ENGINEERING: Transactions of the International Cryogenic Materials Conference - ICMC, Vol. 50
706Furnish, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2003: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
700Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 23
696Koenraad / KemerinkSCANNING TUNNELING MICROSCOPY/SPECTROSCOPY AND RELATED TECHNIQUES: 12th International Conference, STM'03
683Seiler, et al.CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY: 2003 International Conference on Characterization and Metrology for ULSI Technology
657Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 22
615Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 21
557Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 20
509Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 19
497GreenNONDESTRUCTIVE CHARACTERIZATION OF MATERIALS IX: