CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY 2005

2005 International Conference on Characterization and Metrology for ULSI Technology

David G. Seiler, National Institute of Standards and Technology, Semiconductor Electronics Division, Gaithersburg, MD, USA ; Alain C. Diebold, University at Albany, College of Nanoscale Science and Engineering, Albany, NY, USA ; Robert McDonald, Technology Associates, Monte Sereno, CA, USA ; Caroline R. Ayre, Intel, Santa Clara, CA, USA ; Rajinder P. Khosla, National Science Foundation, Elect. and Comm. Systems Div., Arlington, VA, USA ; Stefan Zollner, Freescale Semiconductor, Inc., Austin, TX, USA ; Erik M. Secula, National Institute of Standards and Technology, Semiconductor Electronics Division, Gaithersburg, MD, USA

Conference Location and Date: Richardson, Texas, 15-18 March 2005

Subseries: Materials Physics and Applications

Published September 2005; ISBN 0-7354-0277-9 One Volume Print, CD-ROM included; 688 pages; 8.5 X 11 inches, double column; Hardcover; $245.00

Readership: Scientists and engineers in industry, academia, and government interested in the latest advances in measurement technology critically needed to overcome measurement needs for the semiconductor industry.

All manuscripts were peer-reviewed. The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nanodevices and the corresponding metrology challenges that arise.

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