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SOLID STATE SCIENCE AND TECHNOLOGY: 2nd International Conference on Solid State Science and Technology (ICSSST 2006)

2nd International Conference on Solid State Science and Technology (ICSSST 2006)

H. B. Senin, University of Malaysia Terengganu, Physical Sciences Department, Terengganu, Malaysia ; N. H. Idris, University of Malaysia Terengganu, Physical Sciences Department, Terengganu, Malaysia


AIP Conference Proceedings 909


Conference Location and Date: Kuala Terengganu, Terengganu, Malaysia, 4-6 September 2006


Subseries: Materials Physics and Applications

Published June 2007; ISBN 978-0-7354-0417-5, One Volume, Print; 292 pages; 6 3/8 X 9 1/4 inches; Hardcover; $135.00

Readership: Biologists; chemists; engineers; material scientists; physicists; technologists and those interested in the structure, properties, processing and applications of advanced engineering materials.

The Second International Conference on Solid State Science and Technology 2006 (ICSSST 2006) was a three-day conference on solid state science and technology. The conference was jointly organized by the University College of Science and Technology Malaysia (Kustem) as the host and the Malaysian Solid State Science and Technology Society (MASS). The aim of the conference is to provide a forum for the exchange of knowledge in a high interdisciplinary field and to bring together scientists working in academic and applied research in the field of solid state science and technology. Solid state science is open to all aspects related to solid state: chemistry, physics, mechanics, structure, technology, and modeling and simulation. The chemical aspects concern novel ways of synthesis, new inorganic ceramics, layered, porous and glassy solid, hybrid organic-inorganic compounds synthesized either in the bulk or as thin films or nano-particles and the associated chemical properties (catalysts, sensors, ion exchangers, gas separation, etc.). The physical aspects are related to the structures and surface properties. A particular emphasis is placed on electrical (supermetallic or semiconductors, ionic and mixed conductors, dielectrics), on magnetic and magnet optical features associated with the structure, and on information storage. Optical behavior as a consequence of atomic structure, symmetry and defects. The mechanical properties associated with textural defects and interface behavior are encouraged, particularly in special issues devoted to advanced structural materials.

Related AIP Titles:

CP# Editor(s) Title
1017Senin, et al.CURRENT ISSUES OF PHYSICS IN MALAYSIA: National Physics Conference 2007 - PERFIK 2007
975Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION:
973Paulino, et al.MULTISCALE AND FUNCTIONALLY GRADED MATERIALS 2006: (M&FGM 2006)
955Elert, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2007: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
927Myneni, et al.SINGLE CRYSTAL - LARGE GRAIN NIOBIUM TECHNOLOGY: Proceedings of the International Niobium Workshop
894Thompson / ChimentiREVIEW OF PROGRES IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 26
893Jantsch / SchafflerPHYSICS OF SEMICONDUCTORS: 28th International Conference on the Physics of Semiconductors
890Algora / CorregidorTHERMOPHOTOVOLTAIC GENERATION OF ELECTRICITY: Seventh World Confernece on Thermophotovoltaic Generation of Electricity
850Takano, et al.LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics; LT24
845Furnish, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2005: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
820Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 25
786Kuzmany, et al.ELECTRONIC PROPERTIES OF NOVEL NANOSTRUCTURES: XIX International Winterschool/Euroconference on Electronic Properties of Novel Materials
712Ghosh, et al.MATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications; NUMIFORM 2004 Proceedings of the 8th International Conference on Numerical Methods in Industrial Forming Processes
615Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 21

 

 

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