http://scitation.aip.org/ Journal of Electrochemical Society: Reviews - Current Issue http://link.aip.org/link/?JES/153/K15/1&agg=rss Elon J. Terrell and C. Fred Higgs, III<br/> Chemical mechanical polishing (CMP) is a process that is commonly used to planarize wafer surfaces during fabrication. Although the complex interactions between the wafer, pad, and slurry make the CMP process difficult to predict, it has been postulated that the motion of the slurry fluid at the waf ... [J. Electrochem. Soc. 153, K15 (2006)] published Wed Apr 19, 2006.