J. Electron. Packag.: All Topics http://scitation.aip.org/ J. Electron. Packag.: All Topics Closure to Discussion of `Yield Function for Solder Elastoviscoplastic Modeling' (2005, ASME J. Electron. Packag., 127, pp. 147156) http://link.aip.org/link/doi/10.1115/1.4000902 M. Dube and T. Kundu<br/> Abstract not available. [J. Electron. Packag. 133, 045502 (2011)] published Thu Nov 17, 2011. Discussion: Yield Function for Solder Elastoviscoplastic Modeling (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147156) http://link.aip.org/link/doi/10.1115/1.4000901 Chandra S. Desai<br/> Abstract not available. [J. Electron. Packag. 133, 045501 (2011)] published Tue Oct 25, 2011. Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model http://link.aip.org/link/doi/10.1115/1.4005292 Wei Han, Marc Rensing, Peter O'Brien, and Frank H. Peters<br/> In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector and optoelectronic subsystem. By carefully optimizing the package s ... [J. Electron. Packag. 133, 044502 (2011)] published Fri Dec 9, 2011. A Creep Model for Solder Alloys http://link.aip.org/link/doi/10.1115/1.4005288 Yongchang Lee and Cemal Basaran<br/> Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion proce ... [J. Electron. Packag. 133, 044501 (2011)] published Thu Nov 17, 2011. Thermal Modeling Technique for Multiple Transistors Within Silicon Chip http://link.aip.org/link/doi/10.1115/1.4005291 Tohru Suwa and Hamid Hadim<br/> Although thermal performance is always a critical issue in electronic packaging design at every packaging level, there is a significant lack of reliable and efficient thermal modeling and analysis techniques at the silicon chip level. Sharp temperature increases within small areas, which are called ... [J. Electron. Packag. 133, 041015 (2011)] published Fri Dec 23, 2011. Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change http://link.aip.org/link/doi/10.1115/1.4005294 D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, and K. N. Seetharamu<br/> When two thin plates or layers are bonded together, an extremely thin bond layer of third material exists between the two layers. This research work examines the effect of bond layer on the interfacial shearing and peeling stresses in a bimaterial model. Earlier papers on this topic are based on sev ... [J. Electron. Packag. 133, 041014 (2011)] published Wed Dec 21, 2011. Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations http://link.aip.org/link/doi/10.1115/1.4005451 Etienne L. Bonnaud<br/> Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards to the observed complex mat ... [J. Electron. Packag. 133, 041013 (2011)] published Mon Dec 19, 2011. Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results http://link.aip.org/link/doi/10.1115/1.4005091 A. F. Askari Farahani, M. Al-Bassyiouni, and A. Dasgupta<br/> In this study, the transient response of electronic assemblies to mechanical loading encountered in drop and shock conditions are investigated with transient finite element methods. Many manufacturers face design challenges when evolving new designs for high strain-rate life cycle loading. Examples ... [J. Electron. Packag. 133, 041012 (2011)] published Fri Dec 9, 2011. A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems http://link.aip.org/link/doi/10.1115/1.4005298 Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, and Daryl Santos<br/> Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power and design flexibilities. The main enabler of 3D integration is through-silicon-vias (TSVs) and stacki ... [J. Electron. Packag. 133, 041011 (2011)] published Fri Dec 9, 2011. Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results http://link.aip.org/link/doi/10.1115/1.4005090 A. F. Askari Farahani, M. Al-Bassyiouni, and A. Dasgupta<br/> The development of portable electronics poses design challenges when evolving new designs for high strain-rate life cycle loading, such as in drop events, blast events, vibration, ultrasonic process steps, etc. This paper discusses an experimental investigation of the transient response of a portabl ... [J. Electron. Packag. 133, 041010 (2011)] published Fri Dec 9, 2011. Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal http://link.aip.org/link/doi/10.1115/1.4005297 Peipei Li and Jing Liu<br/> Thermal management has been a critical issue for the safe running of an electronic device. Driving liquid metal with low melting point to extract heat from the thermal source is highly efficient because of its superior thermophysical properties over conventional coolant such as water or the like. In ... [J. Electron. Packag. 133, 041009 (2011)] published Fri Dec 9, 2011. Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium http://link.aip.org/link/doi/10.1115/1.4005296 G. Lorenzini, C. Biserni, L. A. Isoldi, E. D. dos Santos, and L. A. O. Rocha<br/> In this paper, we rely on the Constructal method to optimize the geometry of a Y-shaped cavity embedded into a solid conducting wall. The structure has four degrees of freedom. The objective is to minimize the global thermal resistance between the solid and the cavity. The optimization procedure has ... [J. Electron. Packag. 133, 041008 (2011)] published Fri Dec 9, 2011. Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260 degrees C http://link.aip.org/link/doi/10.1115/1.4005295 Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, and Chin C. Lee<br/> Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 [mu]m gold (Au). The bonding temperature is just 260 degrees C, compatible with the peak reflow temperature of lead- ... [J. Electron. Packag. 133, 041007 (2011)] published Fri Dec 9, 2011. Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties http://link.aip.org/link/doi/10.1115/1.4005293 Chih-Sung Chen<br/> Polymeric material has been applied in electronic product extensively, especially for packaging applications, thus thermomechanical analyses for encapsulated structure are frequently encountered. However, modulus and thermally induced strain of polymeric material are not constant, but time- and temp ... [J. Electron. Packag. 133, 041006 (2011)] published Fri Dec 9, 2011. Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement http://link.aip.org/link/doi/10.1115/1.4005290 Ashish Sinha and Yogendra K Joshi<br/> This paper investigates the use of thermoelectric (TE) devices for thermal management of downhole electronics. The research carried out will help in the mitigation of costs associated with thermal damage of downhole electronics used in oil drilling industry. An experimental set up was prepared where ... [J. Electron. Packag. 133, 041005 (2011)] published Fri Dec 9, 2011. Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections http://link.aip.org/link/doi/10.1115/1.4005289 Ping Nicole An and Paul A. Kohl<br/> Finite element modeling (FEM) is an important component in the design of reliable chip-to-substrate connections. However, FEM can quickly become complex as the number of input/output connections increases. Three-dimensional (3D) chip-substrate models are usually simplified where only portions of the ... [J. Electron. Packag. 133, 041004 (2011)] published Fri Dec 9, 2011. The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions http://link.aip.org/link/doi/10.1115/1.4005375 N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, and Jyeching Lee<br/> Potted electronics are becoming more common in precision-guided artillery due to demands for increased structural-robustness. In field artillery applications, the potted electronics are inactive for most of their lifetime. Projectiles may be stored in a bunker without environmental (temperature and ... [J. Electron. Packag. 133, 041003 (2011)] published Thu Dec 8, 2011. Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations http://link.aip.org/link/doi/10.1115/1.4005300 Issam Mudawar<br/> Boiling water in small channels that are formed along turbine blades has been examined since the 1970s as a means to dissipating large amounts of heat. Later, similar geometries could be found in cooling systems for computers, fusion reactors, rocket nozzles, avionics, hybrid vehicle power electroni ... [J. Electron. Packag. 133, 041002 (2011)] published Thu Dec 8, 2011. Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel http://link.aip.org/link/doi/10.1115/1.4005299 Jing He, Liping Liu, and Anthony M. Jacobi<br/> Thermal analysis with comprehensive treatment of conjugate heat transfer is performed in this study for discrete flush-mounted heat sources in a horizontal channel cooled by air. The numerical model accounts for mixed convection, radiative exchange and two-dimensional conduction in the substrate. Th ... [J. Electron. Packag. 133, 041001 (2011)] published Thu Nov 17, 2011.